Sensor Manufacturing Process Capabilities

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Littelfuse’s dedicated application engineers are available to assist you in every step of the custom product development process. Don’t waste any time! Contact our sensor application experts today.

Custom Sensors

Sensor Manufacturing Process Capabilities





Plastic Assembly:

  • Injection Molding

  • Ultrasonic Welding

  • Heat Staking

Encapsulation:

  • Transfer Over-Mold

  • Low-Pressure Over-mold

  • Epoxy/Urethane Potting

  • Meter/Mix Dispensing

Assembly Methods:

  • Automated

  • Cellular

  • Manual

Custom Magnet Solutions:

  • Magnetic simulation and modeling for customer specific designs

  • Integral magnets within the sensor

  • Magnetic circuits with tight tolerances available

  • Magnetic actuation mapping

Wire Harness and Termination Equipment:

  • Automatic Cut, Strip, and Crimp

  • Apply customer-specified wire/cable and connectors
  • Over-molding of connector to wire/cable sealing options available

100% End of Line Testing:

  • Hermetic Seal Test

  • Magnetic Actuation

  • Contact Resistance

Reed Switch and Hall Effect:

  • Automatic Switch Assembly Machines

  • Custom reed switch forming equipment

  • Automated Testing

  • Automatic Cut and Form

  • Tape + Reel packaging for SMD and other custom design requirements.

Circuit Board Assembly:

  • Vision Systems

  • In-Circuit-Test

  • Pick and Place

  • Reflow soldering

  • Wave soldering

  • Robotic soldering

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